CoWoS may additionally maintain fascinating alternatives for Apple, because it’s a complicated chip packaging tech that may effectively hyperlink graphics processors, reminiscence, and CPU collectively. There could also be some implications as Apple is predicted to maneuver to 2nm chips (made by TSMC, designed by Apple’s silicon groups, and based mostly on Arm reference designs) in 2025.
TSMC Chairman and CEO C.C. Wei referenced this slightly earlier within the yr, telling Nikkei, “AI is so scorching that each one my prospects wish to put AI into their units.” As historical past reveals, Apple has now completed exactly that and Nvidia makes use of CoWoS chip packaging tech in its personal high-performance graphics processors.
What the companions say
Hypothesis apart, that is what Amkor and TSMC needed to say in a assertion saying the settlement: “Amkor is proud to collaborate with TSMC to offer seamless integration of silicon manufacturing and packaging processes by an environment friendly turnkey superior packaging and check enterprise mannequin in the USA,” stated Giel Rutten, Amkor’s president and CEO. “This expanded partnership underscores our dedication to driving innovation and advancing semiconductor know-how whereas guaranteeing resilient provide chains.”
